High power, speed and precision processing with picosecond laser and polygon scanner

Application note № AN1502IL01

Paulius Gečys 1, Mindaugas Gedvilas 1, Laimutis Jacinavičius 2, Ronny De Loor 3, Gediminas Račiukaitis 1,

1Center for Physical Science and Technology, Savanoriu Ave. 231, LT-02300 Vilnius, Lithuania

2 Ekspla, Savanoriu Ave. 237, LT-02300 Vilnius, Lithuania

3 Next Scan Technology BV, Ulftseweg 14, 7064 BD Silvolde, Netherlands

Keywords: Polygon scanner, Picosecond laser, SuperSync, Direct laser marking, Drilling holes, 3D engraving, Selective ablation.


Picosecond lasers in many cases have shown excellent results of material processing for diverse applications. Limiting issues remains cost and efficiency of the processes.
Current developments in high repetition rate lasers provides plenty of laser pulses which are able to ablate the material. However, spatial control of focused laser beam with the high precision is needed.
Assessment of Next Scan Technologies polygon scanner LSE 170 (line 170 mm; 1064/532 nm) and Ekspla Atlantic 60 picosecond laser (60 W, 13 ps, 1 MHz). Polygon scanner is equipped with f-theta objective with focal length of 190 mm and provide telecentric imaging over 170 mm long scan line. Laser pulsing was controlled synchronizing it with polygon using SuperSync™ technology from Next Scan Technologies.
Applicability of laser-polygon pair in precise laser processing was tested, checking adjustment and corrections options in precise beam spot deposition to the material.


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