Pico Master Series Picosecond Laser Micromachining Workstation

Pico Master Series Picosecond Laser Micromachining Workstation
 
Featuring short picosecond pulses, PicoMaster is a cost effective and efficient choice for almost any process development experiment. PicoMaster's industrial design is capable of machining a wide range of micron-scale features in virtually any material at relatively high speed.
Features
  • High Resolution 3D positioning
  • High Accuracy and Repeatability
  • Machining at down to Sub-wavelength Scale
  • High material Removal Rate
  • Ultra-Short pulse (< 10 ps) laser ablation
  • More than one Wavelength at request
  • Flexible control
 
 Applications
  • Ablation
         Micromolds
         Microfluidics
         Thin films electronics
  • Cutting for micromechanics
  • Drilling
         High-aspect-ratio holes for injectors
         Filter
  • Marking
         Surface & intravolume
         Identification & anticounterfighting
  •  Surface Structuring
        Wettability
        Antireflection
        Lubrication
 
 The Picomaster series laser micromachining workstation is a perfect cost-effective tool for diverse material processing applications at the micron scale. The heart of the system is a diode pumped picosecond laser tailored to the specific requirements of a given application. Our engineering experience in mode-locked lasers of more than 25 years warrants that these lasers are reliable and easy to use. Short pulse duration minimizes the heat-affected zone and maximizes the precision of machining. High pulse repetition rate and adequate pulse energy ensure high rate of material removal by ablation. Options of three different working wavelengths and possibility to combine several wavelengths into a single system broaden the user opportunities. Maximum accuracy and spatial resolution are achieved through beam delivery scheme designed by true professionals. Three-axis positioning system for precise 3D ablation and fast galvoscanner for high throughput are the two laser beam steering options to choose from. A Class 1 laser-safe and clean-room compatible enclosure houses a rigid vibration isolated granite platform that ensures robustness and reliability. Full automatic control by customizable software makes the system either flexibly adaptive or process specific.
 
Customization options
  • Vision system for process control
  • Dual axis galvo-scanner for complex high speed beam process
  • Optical setup for helical drilling
  • Rotary and tilt axes for increased machining freedom
  • Several wavelengths in one system (1064 nm, 532 nm and/or 355 nm)
 
Picomaster series ultrafast micromachining workstation design
 
A Class 1 laser-safe enclosure conceals:
 
Positioning system
Positioning axes are supported by a rigid vibrationisolated granite platform. Mechanical robustness ensures high positioning accuracy at high speed and for high fabrication volumes. Once a galvo-scanner is added, the processing speed in 2D rises to extreme values, whereas the rotary and tilt axes transform the workstation into a truly 3D tool.

Laser choice 
  • PL10100 with CW diode pumped regenerative amplifier – a good balance between pulse repetition rate and pulse energy
  • PL11M with cavity-dumped oscillator – MHz pulse repetition rate
  • FOXTROT with pulsed-diode-pumped amplifier – the highest pulse energy
  • 1064, 532 and/or 355 nm wavelength, adjustable to material/process
  • Integrated pulse and energy control providing flexible pulse-on-demand and burst mode operation, as well as fluence manipulation.
 
Optics 
Advanced beam delivery scheme and cleverly designed focusing optics couple to precisely deliver the laser energy to the target spot intended. Wide range of laser fluences is available for the laser machining process.
 
Software
  • Real-time operation in MS Windows environment
  • Synchronized control of positioning and laser subsystems
  • Possibility to integrate additional process-specific devices
  • Compatibility with CAD and graphic file formats
Advanced software provides full automatic control of all system units. Intuitive and easy at use, it makes the system either flexibly adaptive or process specific. To speed the work up, two different kinds of parameters can be saved into separate files, namely: system parameters (such as speed of positioning
stages, laser pulse repetition rate etc.) apart from those related to processing „geometry“ (size, depth, arrangement etc.). Remote control and fast support via internet is foreseen.
 
Options 
  • Vacuum chuck and workpiece fixture
  • Rotary and tilt/dwell axes for increased performance
  • Vision control with CCD camera